recision Intelligence · Craft Core | DeciTech High-Accuracy Cutting System Redefines Piezoelectric Ceramics Microfabrication
As a smart manufacturing expert in piezoelectric ceramic core components, DeciTech's high-precision cutting system is specifically engineered for brittle piezoelectric materials, integrating nanometer-level closed-loop control and laser dynamic compensation technology to achieve ±1μm cutting accuracy, ensuring lattice integrity of ceramic components.
The system incorporates ultra-thin diamond micro-blades, a multi-axis coordinated positioning system, and an AI adaptive parameter module, meeting precision cutting demands for:
Ceramic sheets (0.05-5mm thickness range)
Ring-shaped vibrators
Stacked transducers
This microstructural foundation enables optimized subsequent polarization processes.
Core Value of Equipment - Microscopic Precision Defines Macroscopic Performance
Submicron-level Dynamic Compensation System
● Laser scanning + CCD vision dual alignment system: Real-time correction of material deformation errors.
● Piezoelectric ceramic-specific cutting database: Pre-configured stress relief protocols for PZT, PMN-PT, etc.
● Cutting surface roughness Ra≤0.2μm: Effectively reduces electrode coating defect rates.
Intelligent Adaptive Flexible Processing
● Tool lifespan monitoring system: Auto-compensates for blade wear.
● Pneumatic suspension support technology: Eliminates thin-sheet cutting fragmentation.
● Stepless speed adjustment (0.5-50mm/min): Adapts to ceramics of varying densities.
Full-process Digital Management
● 3D cutting path simulation system: Maximizes material utilization.
● Cloud-based production data storage: Enables batch cutting parameter traceability.
● Modular design compatible with MES system: Yield rate increased to 99.3%.